上课地点：【上海】：同济大学(沪西)/新城金郡商务楼(11号线白银路站) 【深圳分部】：电影大厦(地铁一号线大剧院站)/深圳大学成教院 【北京分部】：北京中山学院/福鑫大楼 【南京分部】：金港大厦(和燕路) 【武汉分部】：佳源大厦（高新二路） 【成都分部】：领馆区1号（中和大道） 【沈阳分部】：沈阳理工大学/六宅臻品 【郑州分部】：郑州大学/锦华大厦 【石家庄分部】：河北科技大学/瑞景大厦
最近开课时间(周末班/连续班/晚班）： Cadence纳米班：2026年1月26日..课程再次升级....学用相长,注重实践.... 以质量赢得尊重....资深工程师亲授.. .. 直播、现场培训皆可 ..用心服务..........--即将开课-- ,,,, |
1, What’s Hot and New about IC?
2, Solve your Custom Design Challenges with Cadence Virtuoso? platform
3, OpenAccess database
4, Introduction to IC61
4, Simulation & Verification
5, Silicon Analysis
6, Digital IC Part I: Front-End (Logic) Design with Cadence Logic Design Team solution
7, Chip Planning Solutions with CPS
8, Conformal Products Update
9, Design for Test with RC/Test Update
10, Design for Low Power with RC/CPF
11, Digital IC Part II: Physical Implementation with Cadence Encounter? platform
? LP implementation with CPF
? Digital Mixed Signal Design using EDI
? Advanced Technology for 32nm and below
? Digital GHz Designs with over 100 MGates
12, Packaging Design with Cadence Allegro? PCB and Packaging Design Solution
? System in Package (SiP) Introduction and Development Trend
? IC Packaging Basics
? IC Packaging Technology Evolution
? System in Packaging (SiP) Development
? What’s SiP
? SiP Future & Benefits
? SiP Development Trends
? What’s Co-design
? SiP Design Flow & Challenges
13, Enterprise Plan-to-Closure Methodology based on Cadence Incisive? Platform
? Enterprise Manager
? VIP Portfolio
? Verification Acceleration and Emulation |
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